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PGO TECH Provides Prime grade 200 mm silicon wafers for IC chip manufacturing industry. The main products are 200 mm silicon ingot and Silicon wafer. The products are usually widely used as silicon substrates for integrated circuit industries such as memory chips, logic and analog, IGBT power devices and mobile computing communication chips.
PGO TECH Growing own 200mm silicon ingot and Polished silicon wafers cover of 8INCH(200MM) low defect, superior flatness silicon wafers, PGO TECH is also conforming to energy-saving trends by providing ultra-high doped silicon wafer, to satisfy low resistance inquiry, which is an important factor in low voltage Power MOSFET device.
Based on core silicon technology, PGO TECH provides complete product portfolio and technical services with its vertically integrated technologies from ingot growth to polishing wafers process.
PGO TECH provides numerous standard 200mm silicon wafer options, also referred to as 8″ silicon wafers,suitable for a wide range of applications.
PGO TECH has a large quantity of 200 mm silicon wafers in stock in P<100>, N<100>, P<111>, and N<111> types & orientations. Below is a sample of some of the silicon wafers we have currently in stock.
TYPE |
DOPANT |
ORIENTATION |
RESISTIVITY (Ohm-cm) |
THICKNESS (um) |
BACKSIDE |
TTV （um） |
FLATS |
PARTICLE |
Control No. |
P |
BORON |
<100> |
1-5 |
725±25 |
Etched |
≤5 |
1 Flat |
<50@>=0.12 |
PG29 |
P |
BORON |
<100> |
0.01-0.02 |
725±25 |
Etched |
≤5 |
1 Flat |
<20@>=0.2 |
PG30 |
P |
BORON |
<100> |
＜0.005 |
725±25 |
Etched |
≤5 |
Notch |
<20@>=0.2 |
PG31 |
P |
BORON |
<100> |
6-18 |
725±25 |
Etched |
≤5 |
Notch |
<20@>=0.2 |
PG32 |
P |
BORON |
<100> |
1-100 |
725±25 |
Etched |
≤5 |
Notch |
<10@>=0.3 |
PG33 |
P |
BORON |
<100> |
0.005-0.02 |
725±25 |
Etched |
≤5 |
Notch |
<20@>=0.2 |
PG34 |
P |
BORON |
<100> |
1-20 |
725±25 |
Etched |
≤5 |
Notch |
<20@>=0.2 |
PG35 |
P |
BORON |
<100> |
1-50 |
1150±20 |
Etched |
≤5 |
Notch |
<20@>=0.2 |
PG36 |
P |
BORON |
<111> |
0.005-0.01 |
1150±20 |
Etched |
≤5 |
Notch |
<20@>=0.2 |
PG37 |
P |
BORON |
<111> |
0.005-0.01 |
1000±20 |
Etched |
≤5 |
Notch |
<20@>=0.2 |
PG38 |
N |
Arsenic |
<100> |
＜0.005 |
725±25 |
Etched |
≤5 |
Notch |
<20@>=0.2 |
PG39 |
N |
Phosphorus |
<100> |
5-20 |
725±25 |
Etched |
≤5 |
Notch |
<20@>=0.2 |
PG40 |
N |
Phosphorus |
<100> |
1-50 |
725±25 |
Etched |
≤5 |
1 Flat |
<20@>=0.2 |
PG41 |
QUALITY ASSURANCCE
● Strict PO auditing involved all departments to assure the feasibility of each Wafers order.
● Process design and validation before bulk production.
● Strictly control on all raw materials, All raw materials reach the High purity.
● On-site inspection to all processes, inspection record keep traceable for 3 years.
● 100% Wafer Flatness Inspection of ADE before shipment.
● 100% Wafer Particle control Inspection of ADE/CR/KLA-Tencor
SHIPPING
http://www.pgosemi.com/
